BUSINESS EQUIPMENT
End Uses
Why Copper
Beryllium?
Computer, Data Communications and Enterprise Equipment reliability over
the life of the product/system is critical to the Service Provider or OEM
for survival in the market place. Electronic communication and data transfer
requirements continue to drive the need for faster and more reliable connectors
and contacts. Performance considerations such as miniaturization, harsh
operating environments, mechanical shock, fatigue resistance, and high
operating frequencies continue to challenge connector designers and material
limitations.
Copper beryllium alloys demonstrate
superior reliability compared to phosphor bronze and nickel alloys because
they exhibit an outstanding combination of material properties:
- high yield strength
that provides excellent spring characteristics and the ability to withstand
high stress loading without failure
- excellent machining
and forming characteristics that enable ease of fabrication
- high electrical
and thermal conductivity that allow for enhanced thermal management
- elevated temperature
durability that allows for reliable and stable performance
If equipment malfunctions and service interruptions cannot
be tolerated, then copper beryllium is the solution to your connector/interconnect
needs.
Copper beryllium telecommunication applications typically
utilize strip product, for stamped, formed
connectors and contacts, and rod and bar
product, for machined contacts.
User Benefit/Solution
Copper beryllium is specified and used in
applications where a combination of high strength, high conductivity, excellent
stress relaxation resistance and formability are required to optimize a
contact design and maximize the reliability of the interface. These properties
allow the end user the benefits of lesser MTBF (mean time between failures),
lower service costs, and greater life cycle reliability. Additionally,
the extensive base of knowledge that exists in the design, tooling and
fabrication of copper beryllium, allows for a significant improvement in
the time to market and time to volume of new products.