Engineered
Materials for 
Handheld
Communications
Used in Input/Output
(I/O) contacts, battery contacts, mezzanine
connectors and anywhere small form factor
and miniaturization are necessary. BrushForm
47 offers improved formability, allowing
smaller parts to bend without cracking.
It also provides significantly higher conductivity,
allowing for the same current capacity with
less material or higher current capacity
with the same amount of material.
A
readily available alternative to copper
titanium, BrushForm 47 represents a prime
example of Brush Wellman's use of Six Sigma
development processes for producing high
performance alloys with a focus on market
needs. BrushForm 47 answers the demands
for higher operating frequencies and temperatures
while simultaneously meeting today's requirements
for the miniaturization of components.
| Formability vs. Strength Comparison |
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Property
Comparison Chart
BrushForm 47™ has Modulus similar to comparison Cu-alloys, but has highest Conductivity; Stress Relaxation is no more than about a net 10% Remaining Stress less than C19900 and C72900 |
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Property
Comparison Chart
BrushForm
47™ offers an advantageous combination
of high Conductivity with good Formability
and Stress Relaxation Resistance.
All Alloys = Nominal 120 ksi 0.2%YS
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