A
readily available alternative to copper
titanium and other high performance alloys,
BrushForm™ 47 offers similar strength
and significantly higher conductivity with
improved formability.
These features, coupled with Brush Wellman quality,
delivery, service and support, make BrushForm 47 an
attractive solution for sub miniature and miniature contact
designs in the mobile communications and personal
electronics industries.
These features, coupled with Brush Wellman quality,
delivery, service and support, make BrushForm 47 an
attractive solution for sub miniature and miniature contact
designs in the mobile communications and personal
electronics industries.
| Physical Properties | |||||
| Elastic Modulus |
Melting Point (Liquidus) |
Melting Point (Solidus) |
Electrical Conductivity |
Density | Thermal Conductivity |
| 20,000 ksi 137.8 GPa |
1975°F 1080°C |
1880°F 1030°C |
47% (nominal) 36.6 n-ohm-m (nominal) |
0.318 lb/in3 8.81 g/cm3 |
135 BTU/hr.
ft F 235 W/mK |
| Mechanical Properties | |||||||||
| Temper | 0.2% Offset Yield Strength (nominal) |
Ultimate
Tensile Strength (nominal) |
Elongation (nominal) |
90° Bend Formability |
Fatigue Strength @107 Cycles (fully reverse bending, R=-1) |
||||
| HT (TH04) | (ksi) | (N/mm2) | (ksi) | (N/mm2) | (%) | GW* | BW* | (ksi) | (N/mm2) |
| 125 | 861 | 135 | 931 | 4 | 2 R/t | 2 R/t | 44 | 305 | |
| *Estimated for gage less than 0.005” (0.13mm) | |||||||||
| Chemical Composition | ||
| UNS C17460 | Weight Percent | |
| Beryllium (Be) | 0.15-0.5 | |
| Zirconium (Zr) | 0.5 (max) | |
| Nickel (Ni) | 1.0-1.4 | |
| Tin (Sn) | 0.25 (max) | |
| Copper (Cu) | Balance | |
