Brush Wellman’s
BrushForm™ 65, a copper beryllium
alloy
designed for use in the Automotive, Appliance
and
DataCom/TeleCom markets, provides high strength,
excellent conductivity and superior formability.
| Physical Properties | |||||
| Elastic Modulus |
Melting Point (Liquidus) |
Melting Point (Solidus) |
Electrical Conductivity |
Density | Thermal Conductivity |
| 20,000 ksi 137.8 GPa |
1975°F 1080°C |
1880°F 1030°C |
65% IACS
Min. 26.5 n-ohm-m |
0.318 lb/in3 8.81 g/cm3 |
156 BTU/hr.
ft F 270 W/mK |
| Mechanical Properties | |||||||||
| Temper | 0.2% Offset Yield Strength (nominal) |
Ultimate
Tensile Strength (nominal) |
Elongation (nominal) |
90° Bend Formability |
Fatigue
Strength @107 Cycles (fully reverse bending, R=-1) |
||||
| HT (TH04) | (ksi) | (N/mm2) | (ksi) | (N/mm2) | (%) | GW* | BW* | (ksi) | (N/mm2) |
| 100-115 | 690-793 | 110-125 | 758-862 | 5 | 1.5 R/t | 1.5 R/t | 45 | 310 | |
| *Gages for less than 0.005” (0.13mm) | |||||||||
| Chemical Composition | ||
| UNS C17460 | Weight Percent | |
| Beryllium (Be) | 0.15-0.5 | |
| Zirconium (Zr) | 0.5 (max) | |
| Nickel (Ni) | 1.0-1.4 | |
| Tin (Sn) | 0.25 (max) | |
| Copper (Cu) | Balance | |







