Processor Sockets

Processor Socket Application Report

Key issues from a design perspective:

• Size Reduction
• Cumulative Stress & the Bauschinger Effect
• Reliability and End-of-Life Contact Force Link
• The Importance of Contact Force
• Formability and Bend Testing
• Bend Testing vs. Forming Reality
• Stress Relaxation & Creep
• Factors Affecting Stress Relaxation
• Cantilever Beams Part I- Stiffness
• Cantilever Beams Part II- Analysis
• Elastic Resilience
• Connector Temperature Rise
• Current Carrying Capacity
• Material Property Directionality
• Nickel as a Coating Material
• Gold as a Contact Material